Nonparametric estimation of SiC film residual stress from the wafer surface profile

Published 2021 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Nonparametric estimation of SiC film residual stress from the wafer surface profile
Authors
Keywords
SiC, Residual stress, Substrate profile, Least squares regression, Nonparametric regression, Second derivative estimation, Differenced method, LowLSR
Journal
MEASUREMENT
Volume -, Issue -, Pages 109238
Publisher
Elsevier BV
Online
2021-03-11
DOI
10.1016/j.measurement.2021.109238
References
View 1 related references

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.