1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration

Published 2020 View Full Article

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Title
1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration
Authors
Keywords
-
Journal
JOURNAL OF LIGHTWAVE TECHNOLOGY
Volume 39, Issue 4, Pages 1155-1161
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2020-11-20
DOI
10.1109/jlt.2020.3039218

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