A new high entropy alloy brazing filler metal design for joining skutterudite thermoelectrics to copper
Published 2020 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
A new high entropy alloy brazing filler metal design for joining skutterudite thermoelectrics to copper
Authors
Keywords
Brazing filler metal, High entropy alloy design, Thermoelectrics, Gallium, Metal joining, Python programming
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 858, Issue -, Pages 157750
Publisher
Elsevier BV
Online
2020-10-31
DOI
10.1016/j.jallcom.2020.157750
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Vanadium is an optimal element for strengthening in both fcc and bcc high-entropy alloys
- (2020) Binglun Yin et al. ACTA MATERIALIA
- Microstructure evolution of warm deformed multilayered Al alloy sheet during brazing
- (2020) M.J. Benoit et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- A novel high entropy CoFeCrNiCu alloy filler to braze SiC ceramics
- (2020) Gang Wang et al. JOURNAL OF THE EUROPEAN CERAMIC SOCIETY
- Effect of Cr and V coatings on W base material in W-Eurofer brazed joints for fusion applications
- (2020) J. de Prado et al. FUSION ENGINEERING AND DESIGN
- Automotive exhaust thermoelectric generators: Current status, challenges and future prospects
- (2019) Zu-Guo Shen et al. ENERGY CONVERSION AND MANAGEMENT
- The microstructural evolution and formation mechanism in Si3N4/AgCuTi/Kovar braze joints
- (2019) Chenglai Xin et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Tuning element distribution, structure and properties by composition in high-entropy alloys
- (2019) Qingqing Ding et al. NATURE
- Controlling interfacial reactions of Ti3SiC2/Ti2AlNb brazed joints by transferring graphene layers
- (2019) Zhan Sun et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Development of high entropy alloys for brazing applications
- (2019) W. Tillmann et al. Welding in the World
- Computational design of metal oxides to enhance the wetting and adhesion of silver-based brazes on yttria-stabilized-zirconia
- (2018) Thanaphong Phongpreecha et al. ACTA MATERIALIA
- Laser brazing of a nickel-based superalloy using a Ni-Mn-Fe-Co-Cu high entropy alloy filler metal
- (2018) Denzel Bridges et al. MATERIALS LETTERS
- Microstructural evolution and thermal stress relaxation of Al 2 O 3 /1Cr18Ni9Ti brazed joints with nickel foam
- (2018) Rujian Sun et al. VACUUM
- Thermoelectric generators: A review of applications
- (2017) Daniel Champier ENERGY CONVERSION AND MANAGEMENT
- Interfacial reactions at the joints of CoSb 3 -based thermoelectric devices
- (2017) Sinn-wen Chen et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Thermoelectric Devices: A Review of Devices, Architectures, and Contact Optimization
- (2017) Ran He et al. Advanced Materials Technologies
- Interfacial structure and stability in Ni/SKD/Ti/Ni skutterudite thermoelements
- (2016) Lanfang Shi et al. SURFACE & COATINGS TECHNOLOGY
- Interfacial microstructure and mechanical properties of ZrB 2 SiC C ceramic and GH99 superalloy joints brazed with a Ti-modified FeCoNiCrCu high-entropy alloy
- (2016) L.X. Zhang et al. MATERIALS & DESIGN
- Fabrication and characterization of nickel contacts for magnesium silicide based thermoelectric generators
- (2015) J. de Boor et al. JOURNAL OF ALLOYS AND COMPOUNDS
- On the Challenges of Reducing Contact Resistances in Thermoelectric Generators Based on Half-Heusler Alloys
- (2015) Pham Hoang Ngan et al. JOURNAL OF ELECTRONIC MATERIALS
- Design of Apparatus for Ni/Mg2Si and Ni/MnSi1.75 Contact Resistance Determination for Thermoelectric Legs
- (2014) Yohann Thimont et al. JOURNAL OF ELECTRONIC MATERIALS
- Interfacial Reaction Between Nb Foil and n-Type PbTe Thermoelectric Materials During Thermoelectric Contact Fabrication
- (2014) Haiyang Xia et al. JOURNAL OF ELECTRONIC MATERIALS
- Thermal Decomposition of Thermoelectric Material CoSb3: A Thermogravimetry Kinetic Analysis
- (2013) Fang Wu et al. JOURNAL OF ELECTRONIC MATERIALS
- Understanding of the contact of nanostructured thermoelectric n-type Bi2Te2.7Se0.3 legs for power generation applications
- (2013) Weishu Liu et al. Journal of Materials Chemistry A
- A Resistance Ratio Analysis for CoSb3-Based Thermoelectric Unicouples
- (2011) Soon-Mok Choi et al. JOURNAL OF ELECTRONIC MATERIALS
- High temperature CoSb3–Cu junctions
- (2011) Krzysztof Tomasz Wojciechowski et al. MICROELECTRONICS RELIABILITY
- BONDING OF ALUMINA AND METAL USING BULK METALLIC GLASS FORMING ALLOY
- (2009) JINJUN ZHANG et al. INTERNATIONAL JOURNAL OF MODERN PHYSICS B
- Solid-Solution Phase Formation Rules for Multi-component Alloys
- (2008) Y. Zhang et al. ADVANCED ENGINEERING MATERIALS
- Vacuum brazing of carbon nanotube bundles
- (2008) Wei Wu et al. MATERIALS LETTERS
Discover Peeref hubs
Discuss science. Find collaborators. Network.
Join a conversationCreate your own webinar
Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.
Create Now