Epoxy composites with high cross-plane thermal conductivity by constructing all-carbon multidimensional carbon fiber/graphite networks

In the new era of 5th generation mobile networks (5G), electron devices need to reach high power, frequency and transmission rate (Gbit/s) so as to dedicate to the 4K video, Virtual Reality, low latency communication, Internet of Things and so on. However, excess heat generated in devices has become a critical bottleneck to influence reliability and performance. Polymer composites with high thermal conductivity (K), low cost and light weight are urgently required for thermal management application. In this paper, all-carbon networks composed of 1D carbon fibers and 2D graphite sheets were constructed to reinforce epoxy at low addition by air flow technology and solution dipping strategy. The all-carbon networks show anisotropic structure, polymer composites have high cross-plane K up to 6.2 W/(m.K) with 17.48 vol% CFs and only 6.34 vol% graphite adhesive. The all-carbon networks could also improve the thermostability and electrical conductivity. Furthermore, the polymer composites with all-carbon networks display strong thermal management capability as observed by thermal infrared imaging. The epoxy composites demonstrate strong potential as interface materials integrated in electronic devices for heat dissipation and composites for aerospace and electromagnetic shielding.

Automated summary

This paper explores the use of all-carbon networks to enhance the thermal conductivity, heat stability, and electrical conductivity of epoxy composites for thermal management in electronic devices and aerospace applications.