Comparing endwall heat transfer among staggered pin fin, Kagome and body centered cubic arrays

Title
Comparing endwall heat transfer among staggered pin fin, Kagome and body centered cubic arrays
Authors
Keywords
Lattice structures, Transient liquid crystals, Heat transfer, Endwall
Journal
APPLIED THERMAL ENGINEERING
Volume 185, Issue -, Pages 116306
Publisher
Elsevier BV
Online
2020-11-08
DOI
10.1016/j.applthermaleng.2020.116306

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