Improvement of the Adhesive Strength of the Leadframe and Epoxy Resin by Forming Organic Molecules-Metal Composite Interface

Title
Improvement of the Adhesive Strength of the Leadframe and Epoxy Resin by Forming Organic Molecules-Metal Composite Interface
Authors
Keywords
-
Journal
Electronics and Communications in Japan
Volume 100, Issue 1, Pages 67-71
Publisher
Wiley
Online
2016-12-14
DOI
10.1002/ecj.11924

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