Journal
FRONTIERS IN BIOENGINEERING AND BIOTECHNOLOGY
Volume 8, Issue -, Pages -Publisher
FRONTIERS MEDIA SA
DOI: 10.3389/fbioe.2020.602318
Keywords
regenerated cellulose; thermal conductivity; boron nitride nanosheets; dual-crosslink; urea
Funding
- Natural Science Foundation of Jiangsu Province [BK20200501]
- Research Start-Up Fund of the Nanjing University of Science and Technology [AE89991/222]
- 2020 open projects of the Key Laboratory of Advanced Technologies of Materials, Ministry of Education of China, Southwest Jiaotong University [KLATM202010]
- Fundamental Research Funds for the Central Universities [30920021121]
- China Postdoctoral Science Foundation [2020M671497, 2020T130300]
- National Natural Science Foundation of China [51573102, 51421061]
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The highly thermo-conductive but electrically insulating film, with desirable mechanical performances, is extremely demanded for thermal management of portable and wearable electronics. The integration of boron nitride nanosheets (BNNSs) with regenerated cellulose (RC) is a sustainable strategy to satisfy these requirements, while its practical application is still restricted by the brittle fracture and loss of toughness of the composite films especially at the high BNNS addition. Herein, a dual-crosslinked strategy accompanied with uniaxial pre-stretching treatment was introduced to engineer the artificial RC/BNNS film, in which partial chemical bonding interactions enable the effective interfiber slippage and prevent any mechanical fracture, while non-covalent hydrogen bonding interactions serve as the sacrifice bonds to dissipate the stress energy, resulting in a simultaneous high mechanical strength (103.4 MPa) and toughness (10.2 MJ/m(3)) at the BNNS content of 45 wt%. More importantly, attributed to the highly anisotropic configuration of BNNS, the RC/BNNS composite film also behaves as an extraordinary in-plane thermal conductivity of 15.2 W/m center dot K. Along with additional favorable water resistance and bending tolerance, this tactfully engineered film ensures promised applications for heat dissipation in powerful electronic devices.
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