4.7 Article

Toward high thermal conductive aramid nanofiber papers: Incorporating hexagonal boron nitride bridged by silver nanoparticles

Journal

POLYMER COMPOSITES
Volume 42, Issue 4, Pages 1773-1781

Publisher

WILEY
DOI: 10.1002/pc.25932

Keywords

aramid nanofibers; hexagonal boron nitride; silver nanoparticles; thermal conductivity

Funding

  1. National Natural Science Foundation of China [51803110]
  2. Shaanxi Natural Science Basic Research Program [2020JQ724]
  3. National Key Research and Development Plan [2017YBF0308302]
  4. New Style Think Tank of Shaanxi Universities (Research Center for Auxiliary Chemistry and New Materials Development, Shaanxi University of Science and Technology) [ACNM-202108]
  5. Shaanxi Provincial Education Department [20JT006]

Ask authors/readers for more resources

A novel thermal conductive and electrical insulation h-BN@AgNPs/ANFs composite paper was successfully fabricated with high thermal conductivity and excellent mechanical properties, suitable for electronic packaging applications.
In this work, a novel thermal conductive and electrical insulation h-BN@AgNPs/ANFs composite paper was fabricated by vacuum-assisted filtration approach. Specifically, hexagonal boron nitride (h-BN) was incorporated via polydopamine pretreatment and subsequent decoration by silver nanoparticles, which served as bridges to link neighboring h-BN sheets. The results revealed that the thermal conductivity of as-prepared composite paper increased to 1.032 W/m K with 40 wt% filler loading, about 464% higher than the pure ANFs paper, which was attributed to the efficient thermal conductive networks within the paper and strong interfacial combination through hydrogen bonding. Besides, the as-prepared composite paper exhibited excellent mechanical property with the maximum tensile strength over 90 MPa, and good electrical insulation performance. More importantly, this work provided a promising strategy to achieve high thermal conductivity ANFs based composite paper by constructing efficient thermal conductive networks, which had potential to be used in the field of electronic packaging.

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