4.6 Article

Preparation of highly thermally conductive epoxy composites via constructing a vertically aligned foam of cetyltrimethylammonium bromide-graphene@polydopamine-multi-walled carbon nanotubes

Journal

JOURNAL OF MATERIALS SCIENCE
Volume 56, Issue 13, Pages 7951-7965

Publisher

SPRINGER
DOI: 10.1007/s10853-021-05795-4

Keywords

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Funding

  1. National Natural Science Foundation of China [51773167, 21706208]
  2. Natural Science Foundation of Shaanxi Province [2018JM5036]
  3. China Postdoctoral Science Foundation [2019M650268]
  4. Opening Project of the Key Laboratory of Functional Nanocomposites of Shanxi Province (North University) [NFCM201701]

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A three-dimensional thermal network was proposed to reduce interface thermal resistance in polymer matrix, leading to the successful fabrication of CTAB-graphene@PDA-MWCNT foam with vertical orientation and achieving a maximum thermal conductivity of 30.09 Wm(-1) K-1.
Graphene has attracted considerable attention due to the distinguished thermal property to efficiently enhance the thermal transport of polymers. However, high interface thermal resistance (ITR) makes the actual enhancement efficiency of thermal conductivity for graphene/polymer composites below the predicted value. Herein, we proposed to pre-construct the three-dimensional (3D) thermal network in polymer matrix to efficiently reduce the ITR. The electropositive cetyltrimethylammonium bromide (CTAB)-functionalized graphene and the electronegative polydopamine (PDA)-functionalized MWCNT self-assembled to form an interconnected hybrid (CTAB-graphene@PDA-MWCNT) foam with vertical orientation via the directional freezing method. This unique structure provides a shortcut for phonon transmission and endows the obtained composite with the maximum thermal conductivity of 30.09 Wm(-1) K-1 at 9 vol% filler contents. More importantly, PDA at the interface effectively hinders the electron transmission between fillers, resulting in moderate insulation of the prepared composite. (The volume resistivity is 3.2 x 10(6) omega cm.) This demonstrates the prepared composite displays a promising prospect to tackle thermal management problems in modern electronics.

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