Monolithic 3D stacked multiply-accumulate units

Title
Monolithic 3D stacked multiply-accumulate units
Authors
Keywords
Multiply-accumulate, M3D stacking, TSV-Based 3D stacking, ASIC
Journal
INTEGRATION-THE VLSI JOURNAL
Volume 76, Issue -, Pages 183-189
Publisher
Elsevier BV
Online
2020-10-29
DOI
10.1016/j.vlsi.2020.10.006

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