The novel application of nonmetals from waste printed circuit board in high-performance thermal management materials

Title
The novel application of nonmetals from waste printed circuit board in high-performance thermal management materials
Authors
Keywords
Thermal management materials, Waste printed circuit board, Physical performance, Finite element simulation
Journal
Publisher
Elsevier BV
Online
2020-08-31
DOI
10.1016/j.compositesa.2020.106096

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