Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives

Epoxy-based composite adhesives: Effect of hybrid fillers on thermal conductivity, rheology, and lap shear strength

(2019) Rajesh Kumar et al.   POLYMERS FOR ADVANCED TECHNOLOGIES

Roles of organic and inorganic additives on the surface quality, morphology, and polarization behavior during nickel electrodeposition from various baths: a review

(2019) U. S. Mohanty et al.   JOURNAL OF APPLIED ELECTROCHEMISTRY

Unveiling the Chemical Reactions Involved in Moisture-Induced Weakening of Adhesion Between Aluminum and Epoxy Resin

(2018) Shuji Ogata et al.   Journal of Physical Chemistry C

Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

(2018) Chengshuo Jiang et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Molecular understanding of the adhesive interactions between silica surface and epoxy resin: Effects of interfacial water

(2018) Chisa Higuchi et al.   JOURNAL OF COMPUTATIONAL CHEMISTRY

A novel thermally conductive transparent die attach adhesive for high performance LEDs

(2018) Kai Zhang et al.   MATERIALS LETTERS

Adhesion mechanism of bisphenol A diglycidyl ether (BADGE) on an α-Fe 2 O 3 (0001) surface

(2017) Ji Hye Lee et al.   JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY

Mechanism of adhesion of the diglycidyl ether of bisphenol A (DGEBA) to the Fe(100) surface

(2016) Ji Hye Lee et al.   COMPOSITES SCIENCE AND TECHNOLOGY

Printable optically transparent adhesive processing for bonding of LED chips to packages

(2016) Yu-Chou Shih et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Study of the adhesion and interface of the low-temperature bonding of vacuum ultraviolet-irradiated cyclo-olefin polymer using electron microscopy

(2016) Shin Horiuchi et al.   POLYMER JOURNAL

Polymer chain dynamics in epoxy based composites as investigated by broadband dielectric spectroscopy

(2016) Mohammad K. Hassan et al.   Arabian Journal of Chemistry

A review on light-emitting diode based automotive headlamps

(2015) Xingming Long et al.   RENEWABLE & SUSTAINABLE ENERGY REVIEWS

Role of Transparent Die Attach Adhesives for Enhancing Lumen Output of Midpower LED Emitters With Standard MESA Structure

(2015) Yu-Chou Shih et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

A Bipodal Dicyano Anchor Unit for Single-Molecule Spintronic Devices

(2013) Yuta Tsuji et al.   CHEMPHYSCHEM

Lap shear strength and thermal stability of diglycidyl ether of bisphenol a/epoxy novolac adhesives with nanoreinforcing fillers

(2013) Mohammad Mansourian-Tabaei et al.   JOURNAL OF APPLIED POLYMER SCIENCE

A Molecular Mechanism for the Water–Hydroxyl Balance during Wetting of TiO2

(2013) M. Amft et al.   Journal of Physical Chemistry C

Molecular Understanding of the Adhesive Force between a Metal Oxide Surface and an Epoxy Resin: Effects of Surface Water

(2012) Takayuki Semoto et al.   BULLETIN OF THE CHEMICAL SOCIETY OF JAPAN

Modeling of Reactive Diffusion: Mechanism and Kinetics of the Intermetallics Growth in Ag/Ag Interconnections

(2012) R. Filipek et al.   JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE

Orbital Control of Single-Molecule Conductance Perturbed by π-Accepting Anchor Groups: Cyanide and Isocyanide

(2012) Junya Koga et al.   Journal of Physical Chemistry C

Corrosion Protection of Electrically Conductive Surfaces

(2012) Jian Song et al.   Metals

VESTA 3for three-dimensional visualization of crystal, volumetric and morphology data

(2011) Koichi Momma et al.   JOURNAL OF APPLIED CRYSTALLOGRAPHY

Light emitting diodes reliability review

(2011) Moon-Hwan Chang et al.   MICROELECTRONICS RELIABILITY

Spectroscopic characterization of β-FeSi2 single crystals and homoepitaxial β-FeSi2 films by XPS and XAS

(2010) F. Esaka et al.   APPLIED SURFACE SCIENCE

Design method of high-efficient 
LED headlamp lens

(2010) Fei Chen et al.   OPTICS EXPRESS

Effect of material, geometry, surface treatment and environment on the shear strength of single lap joints

(2009) Lucas. F.M. da Silva et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Accurate Molecular Van Der Waals Interactions from Ground-State Electron Density and Free-Atom Reference Data

(2009) Alexandre Tkatchenko et al.   PHYSICAL REVIEW LETTERS

Thermal transient characteristics of die attach in high power LED PKG

(2008) Hyun-Ho Kim et al.   MICROELECTRONICS RELIABILITY

Influence of adhesive thickness and filler content on the mechanical performance of aluminum single-lap joints bonded with aluminum powder filled epoxy adhesive

(2007) Ramazan Kahraman et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY