Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation

Published 2020 View Full Article

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Title
Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation
Authors
Keywords
Microweld formation & breakage, Bonding mechanism, Molecular dynamics simulation, Ultrasonic wire bonding
Journal
MATERIALS & DESIGN
Volume 192, Issue -, Pages 108718
Publisher
Elsevier BV
Online
2020-04-05
DOI
10.1016/j.matdes.2020.108718

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