Journal
NPJ QUANTUM INFORMATION
Volume 6, Issue 1, Pages -Publisher
NATURE PUBLISHING GROUP
DOI: 10.1038/s41534-020-00289-8
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Funding
- Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA)
- Assistant Secretary of Defense for Research, Engineering under Air Force Contract [FA8721-05-C-0002]
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As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may require, access via the third dimension to alleviate interconnect crowding. Through-silicon vias (TSVs) represent a promising approach to three-dimensional (3D) integration in superconducting qubit arrays-provided they are compact enough to support densely-packed qubit systems without compromising qubit performance or low-loss signal and control routing. In this work, we demonstrate the integration of superconducting, high-aspect ratio TSVs-10 mu m wide by 20 mu m long by 200 mu m deep-with superconducting qubits. We utilize TSVs for baseband control and high-fidelity microwave readout of qubits using a two-chip, bump-bonded architecture. We also validate the fabrication of qubits directly upon the surface of a TSV-integrated chip. These key 3D-integration milestones pave the way for the control and readout of high-density superconducting qubit arrays using superconducting TSVs.
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