Insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond: A reactive molecular dynamics simulation

Title
Insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond: A reactive molecular dynamics simulation
Authors
Keywords
Diamond, ReaxFF MD, CMP, Friction and wear
Journal
TRIBOLOGY INTERNATIONAL
Volume 148, Issue -, Pages 106308
Publisher
Elsevier BV
Online
2020-03-18
DOI
10.1016/j.triboint.2020.106308

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