Effects of combined chemical design (Cu addition) and topographical modification (SLA) of Ti-Cu/SLA for promoting osteogenic, angiogenic and antibacterial activities

Title
Effects of combined chemical design (Cu addition) and topographical modification (SLA) of Ti-Cu/SLA for promoting osteogenic, angiogenic and antibacterial activities
Authors
Keywords
Ti-Cu, SLA, Peri-implantitis, Osseointegration
Journal
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
Volume 47, Issue -, Pages 202-215
Publisher
Elsevier BV
Online
2020-02-22
DOI
10.1016/j.jmst.2019.10.045

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