A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging

Published 2020 View Full Article

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Title
A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging
Authors
Keywords
Boundary element method, Elastic contact problem, Thermoelastic contact, Microelectronic packaging, Variable thermal contact resistance
Journal
ENGINEERING ANALYSIS WITH BOUNDARY ELEMENTS
Volume 115, Issue -, Pages 28-39
Publisher
Elsevier BV
Online
2020-04-14
DOI
10.1016/j.enganabound.2020.02.011

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