4.4 Article

Printed Circuit Board (PCB) Brazing and Ion Source Integration of a High-Field Asymmetric Ion Mobility Spectrometry (FAIMS) Chip

Journal

ANALYTICAL LETTERS
Volume 54, Issue 8, Pages 1377-1388

Publisher

TAYLOR & FRANCIS INC
DOI: 10.1080/00032719.2020.1803347

Keywords

Brazing; high-field asymmetric ion mobility spectrometry (FAIMS); ion source; needle-to-ring structure; printed circuit board (PCB)

Funding

  1. National Natural Science Foundation of China [61864001]
  2. Natural Science Foundation of GuangXi [2017GXNSFGA198005, 2017GXNSFAA198256]
  3. Foundation of Guangxi Key Laboratory of Automatic Detecting Technology and Instruments (Guilin University of Electronic Technology) [YQ18113]
  4. Edanz Group China

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In this study, a FAIMS chip based on PCB brazing technology was fabricated, with a needle-to-ring ion source structure. By optimizing parameters, the peak value of the FAIMS spectrum was increased, and the limit of detection for ethanol as the analyte was approximately 0.06 mg/L.
A high-field asymmetric ion mobility spectrometry (FAIMS) chip based on printed circuit board (PCB) brazing has been fabricated. A needle-to-ring structure was used as the ion source. The ring electrode was formed by punching a 3 mm hole on the PCB and covering it with copper. The FAIMS chip was composed of two PCB boards connected by brazing. The peak value of a FAIMS spectrum was increased by reducing the ballast resistance and increasing the discharge voltage and gas velocity. When ethanol was used as the analyte, the limit of detection (LOD) is approximately 0.06 mg/L.

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