4.8 Article

Ferrimagnetic Skyrmions in Topological Insulator/Ferrimagnet Heterostructures

Journal

ADVANCED MATERIALS
Volume 32, Issue 34, Pages -

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.202003380

Keywords

Dzyaloshinskii-Moriya interaction; ferrimagnetic skyrmions; ferrimagnets; topological insulators

Funding

  1. NSF [1611570, 1810163]
  2. Nanosystems Engineering Research Center for Translational Applications of Nanoscale Multiferroic Systems (TANMS), the U.S. Army Research Office MURI program [W911NF-16-1-0472, W911NF-15-1-10561]
  3. Spins and Heat in Nanoscale Electronic Systems (SHINES) Center - US Department of Energy (DOE) [DE-SC0012670]
  4. NSF MRSEC [DMR-1720595]
  5. Directorate For Engineering [1611570] Funding Source: National Science Foundation
  6. Div Of Electrical, Commun & Cyber Sys [1611570] Funding Source: National Science Foundation

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Magnetic skyrmions are topologically nontrivial chiral spin textures that have potential applications in next-generation energy-efficient and high-density spintronic devices. In general, the chiral spins of skyrmions are stabilized by the noncollinear Dzyaloshinskii-Moriya interaction (DMI), originating from the inversion symmetry breaking combined with the strong spin-orbit coupling (SOC). Here, the strong SOC from topological insulators (TIs) is utilized to provide a large interfacial DMI in TI/ferrimagnet heterostructures at room temperature, resulting in small-size (radius approximate to 100 nm) skyrmions in the adjacent ferrimagnet. Antiferromagnetically coupled skyrmion sublattices are observed in the ferrimagnet by element-resolved scanning transmission X-ray microscopy, showing the potential of a vanishing skyrmion Hall effect and ultrafast skyrmion dynamics. The line-scan spin profile of the single skyrmion shows a Neel-type domain wall structure and a 120 nm size of the 180 degrees domain wall. This work demonstrates the sizable DMI and small skyrmions in TI-based heterostructures with great promise for low-energy spintronic devices.

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