Pre-treatment of dielectrics and technological process for deposition of chemical copper layers from copper solution with improved ecological impact

Published 2020 View Full Article

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Title
Pre-treatment of dielectrics and technological process for deposition of chemical copper layers from copper solution with improved ecological impact
Authors
Keywords
-
Journal
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING
Volume 98, Issue 2, Pages 81-87
Publisher
Informa UK Limited
Online
2020-03-13
DOI
10.1080/00202967.2020.1718941

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