4.7 Article

Effect of heat treatment on the tensile behavior of selective laser melted Ti-6Al-4V by in situ X-ray characterization

Journal

ACTA MATERIALIA
Volume 189, Issue -, Pages 93-104

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2020.03.003

Keywords

Selective laser melting; Ti-6Al-4V; In situ X-ray diffraction; Tensile deformation

Funding

  1. National Natural Science Foundation of China [51671127, 51825101]
  2. United States Department of Energy, Office of Science, Office of Basic Energy Sciences [DE-AC02-06CH11357]

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Selective Laser Melted Ti-6Al-4V (as-SLMed) exhibits decreased yield strength, increased work hardening, and increased ductility after heat treatment at 730 degrees C (HT-730) or 900 degrees C (HT-900) for 2 h. To understand the change of mechanical properties, in situ high energy X-ray diffraction (HEXRD) is used to examine the phase composition, load partitioning, slip system activity, and dislocation density evolution in all three specimens. The as-SLMed specimen is dominated by martensitic alpha'. After heat treatment, alpha' partly or fully decomposes into alpha+beta, reducing the yield strength. In HT-730, beta precipitates with confined size show much higher lattice strain than the alpha'/alpha matrix during deformation; in HT-900, the lattice strain difference is mostly eliminated. This is a key reason for the increased ductility in HT-900. From the anisotropic lattice strain development, basal slip is identified as the easiest slip system in alpha'/alpha. Using an elasto-plastic self-consistent (EPSC) model, the critical resolved shear stress ratio between prismatic slip and basal slip (CRSSprism/CRSSbasal) is estimated to be 1.31 and 1.16 in the as -SLMed and the HT-900 specimens, respectively. The alpha phase in HT-900 is able to activate multiple slip systems and accumulate more dislocations during plastic deformation. This explains why HT-900 has better ductility and higher work hardening rate than the other two specimens. (C) 2020 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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