Journal
SEMICONDUCTORS
Volume 54, Issue 1, Pages 144-149Publisher
PLEIADES PUBLISHING INC
DOI: 10.1134/S1063782620010108
Keywords
etching of SiC; microwave field transistors; mesa structures
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Methods of micro-profiling of 4H-SiC are described: formation of mesa structures with inclined walls (off-vertical wall inclination angle exceeding 45 degrees) by reactive ion etching; etching of mesa structures with a flat bottom and inclined walls (off-vertical wall inclination angle being smaller than 45 degrees) by ion-beam and reactive ion plasma etching. The application of etching methods in the fabrication technology of 4H-SiC-based mesa-epitaxial field-effect transistors with a Schottky gate is demonstrated.
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