4.7 Article

Junction growth and interdiffusion during ultrasonic additive manufacturing of multi-material laminates

Journal

SCRIPTA MATERIALIA
Volume 177, Issue -, Pages 101-105

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2019.10.004

Keywords

Ultrasonic additive manufacturing; Dissimilar metal welding; Intermetallics; Solid-phase welding

Funding

  1. Army Research Office [W911NF-17-1-0342]

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Ultrasonic additive manufacturing is a promising approach for making net-shaped multi-material laminates from material combinations difficult to process with fusion-based additive manufacturing techniques. The properties of these multi-material laminates depend sensitively on the interface between the constituents, which can be decorated with pores as well as thin intermetallic layers. Here, we develop process models for junction growth and interdiffusion during ultrasonic additive manufacturing of dissimilar metals. These process models are validated against published experimental data, then used to generate process diagrams which reveal that high normal loads and high sonotrode velocities can reduce intermetallic growth while maintaining strong interlayer bonding. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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