Flexible thermal interfacial materials with covalent bond connections for improving high thermal conductivity

Title
Flexible thermal interfacial materials with covalent bond connections for improving high thermal conductivity
Authors
Keywords
-
Journal
CHEMICAL ENGINEERING JOURNAL
Volume 383, Issue -, Pages 123151
Publisher
Elsevier BV
Online
2019-10-15
DOI
10.1016/j.cej.2019.123151

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