Effects of electric/magnetic impact on the transient fracture of interface crack in piezoelectric-piezomagnetic sandwich structure: anti-plane case

Due to the incompatibility of the interlaminar deformations, the interface debonding or cracking usually happens in a layered magnetoelectric (ME) structure under an applied load. In this paper, the transient responses of the anti-plane interface cracks in piezoelectric (PE)-piezomagnetic (PM) sandwich structures are studied by the standard methods of the integral transform and singular integral equation. Discussion on the numerical examples indicates that the PE-PM-PE structure under electric impact is more likely to fracture than the PM-PE-PM structure under a magnetic impact. The dynamic stress intensity factors (DSIFs) are more sensitive to the variation of the active layer thickness. The effects of the material constants on the DSIFs are dependent on the roles played by PE and PM media during the deformation process.