Creep deformation simulation of adhesively bonded joints at different temperature levels using a modified power-law model

Title
Creep deformation simulation of adhesively bonded joints at different temperature levels using a modified power-law model
Authors
Keywords
-
Journal
POLYMER TESTING
Volume 79, Issue -, Pages 106087
Publisher
Elsevier BV
Online
2019-08-26
DOI
10.1016/j.polymertesting.2019.106087

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