A 50-kW Air-Cooled SiC Inverter With 3-D Printing Enabled Power Module Packaging Structure and Genetic Algorithm Optimized Heatsinks

Published 2019 View Full Article

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Title
A 50-kW Air-Cooled SiC Inverter With 3-D Printing Enabled Power Module Packaging Structure and Genetic Algorithm Optimized Heatsinks
Authors
Keywords
-
Journal
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
Volume 55, Issue 6, Pages 6256-6265
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2019-08-31
DOI
10.1109/tia.2019.2938471

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