Investigating the effect of binder and aggregate application rates on performance of chip seals via digital image processing and sweep tests

Published 2019 View Full Article

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Title
Investigating the effect of binder and aggregate application rates on performance of chip seals via digital image processing and sweep tests
Authors
Keywords
-
Journal
CONSTRUCTION AND BUILDING MATERIALS
Volume 222, Issue -, Pages 213-221
Publisher
Elsevier BV
Online
2019-06-24
DOI
10.1016/j.conbuildmat.2019.06.089

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