4.7 Article

Extrusion-based 3D direct ink writing of NiZn-ferrite structures with viscoelastic ceramic suspension

Journal

CERAMICS INTERNATIONAL
Volume 46, Issue 5, Pages 6469-6476

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.ceramint.2019.11.127

Keywords

Direct ink writing; Auger-extrusion; NiZn-Ferrite; Magnetic core; Ceramic 3D printing

Funding

  1. Basic Science Research Program through the National Research Foundation of Korea (NRF) - Ministry of Education [NRF-2018R1D1A1B07043117]
  2. Nano R&D program through the Korea Science and Engineering Foundation - Ministry of Science, ICT and Future Planning [NRF-2015M3A7B4050307]
  3. Infrastructure Program for New Value Creation of Traditional Ceramic Industry under the Ministry of Trade, Industry and Energy [BUS010025000]
  4. National Research Foundation of Korea [22A20130012589] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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Advances in additive manufacturing (AM), represented as the instant evolution of design files into fully functional products, provide customer-centric smart manufacturing solutions that are increasingly replacing traditional manufacturing methods in various industries. However, the advantages of AM often diminish when applied to the production of ceramic components, owing to the demanding nature of ceramic materials. Extrusion-based direct ink writing (DIW) is considered one of the few AM technologies applicable to ceramic materials. Precise control of the ceramic suspension is required in extrusion-based 3D DIW to create 3D structures for various industrial products. This study describes a fundamental relationship between the rheological properties of the ceramic suspensions and their 3D DIW printability. The theological properties determine flowability, DIW height, and the overhang angle that can be achieved in extrusion-based 3D DIW. The printability of NiZn-ferrite suspensions with various rheological properties was investigated, and the potential of 3D DIW amenable to manufacturing ceramic electronic components was demonstrated.

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