Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 30, Issue 19, Pages 17583-17590Publisher
SPRINGER
DOI: 10.1007/s10854-019-02107-0
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Funding
- National Key R&D Program of China [2017YFB0305700]
- Natural Science Foundation of China [51475220]
- Key project of State Key Laboratory of Advanced Welding and Joining [AWJ-19Z04]
- Six talent peaks project in Jiangsu Province [XCL-022]
- Qing Lan Project, China Postdoctoral Science Foundation [2016M591464]
- International Cooperation Project [2015DFA50470]
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In this paper, the influences of adding Titanium (Ti) nanoparticles on melting characteristics, wettability, shear properties and the growth of interfacial intermetallic compounds (IMC) of Sn58Bi solder were investigated. The results show that the addition of Ti nanoparticles improved the wettability and shear strength of Sn58Bi solder, and the optimum additive content was 0.1 wt%. The microstructure of the Sn58Bi solder was refined obviously with the addition of Ti nanoparticles. The thickness of interfacial IMC reduced significantly by adding Ti nanoparticles. However, doping Ti nanoparticles had the slight effect on the melting temperature of Sn58Bi solder. Moreover, the thickness of IMC at the Sn58Bi/Cu interface was distinctly larger than that of Sn58Bi-0.1Ti/Cu solder after multiple reflows, which means that the addition of Ti nanoparticles could suppress the growth of IMC at solder/Cu interface during multiple reflows.
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