Curing Kinetics and the Properties of KH560-SiO2/Polyethersulfone/Bismaleimide-Phenolic Epoxy Resin Composite
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Title
Curing Kinetics and the Properties of KH560-SiO2/Polyethersulfone/Bismaleimide-Phenolic Epoxy Resin Composite
Authors
Keywords
Bismaleimide, Phenolic epoxy resin, Curing kinetics, Mechanical properties, Dielectric properties
Journal
Journal of Inorganic and Organometallic Polymers and Materials
Volume -, Issue -, Pages -
Publisher
Springer Science and Business Media LLC
Online
2019-08-22
DOI
10.1007/s10904-019-01290-1
References
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