Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conduction

Published 2019 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conduction
Authors
Keywords
EMI shielding, Thermal conductivity, Low percolation, 3D metal shell network
Journal
COMPOSITES SCIENCE AND TECHNOLOGY
Volume 182, Issue -, Pages 107778
Publisher
Elsevier BV
Online
2019-08-09
DOI
10.1016/j.compscitech.2019.107778

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.