The Zn accumulation behavior, phase evolution and void formation in Sn-xZn/Cu systems by considering trace Zn: a combined experimental and theoretical study

Published 2019 View Full Article

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Title
The Zn accumulation behavior, phase evolution and void formation in Sn-xZn/Cu systems by considering trace Zn: a combined experimental and theoretical study
Authors
Keywords
Sn/Cu solder joint, Zinc, Accumulation behavior, Phase evolution, Kirkendall void
Journal
Journal of Materials Research and Technology-JMR&T
Volume -, Issue -, Pages -
Publisher
Elsevier BV
Online
2019-07-30
DOI
10.1016/j.jmrt.2019.07.023

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