Modeling and Experiment of the Critical Depth of Cut at the Ductile–Brittle Transition for a 4H-SiC Single Crystal
Published 2019 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Modeling and Experiment of the Critical Depth of Cut at the Ductile–Brittle Transition for a 4H-SiC Single Crystal
Authors
Keywords
-
Journal
Micromachines
Volume 10, Issue 6, Pages 382
Publisher
MDPI AG
Online
2019-06-07
DOI
10.3390/mi10060382
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Improved resistance to thermal fatigue of active metal brazing substrates for silicon carbide power modules using tough silicon nitrides with high thermal conductivity
- (2018) Hiroyuki Miyazaki et al. CERAMICS INTERNATIONAL
- A review on the processing technologies of carbon nanotube/silicon carbide composites
- (2018) Daoyang Han et al. JOURNAL OF THE EUROPEAN CERAMIC SOCIETY
- Analysis of grit interference mechanisms for the double scratching of monocrystalline silicon carbide by coupling the FEM and SPH
- (2017) Nian Duan et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC
- (2017) Peizhi Wang et al. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
- Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing
- (2016) Shujuan Li et al. JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME
- Friction behavior in nanoscratching of reaction bonded silicon carbide ceramic with Berkovich and sphere indenters
- (2016) Feihu Zhang et al. TRIBOLOGY INTERNATIONAL
- The mechanism of ductile deformation in ductile regime machining of 6H SiC
- (2015) Gaobo Xiao et al. COMPUTATIONAL MATERIALS SCIENCE
- Study on ductile-mode mirror grinding of SiC ceramic freeform surface using an elliptical torus-shaped diamond wheel
- (2015) J. Xie et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- Deformation and removal characteristics in nanoscratching of 6H-SiC with Berkovich indenter
- (2015) Binbin Meng et al. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
- Material removal behavior in ultrasonic-assisted scratching of SiC ceramics with a single diamond tool
- (2014) Jianguo Cao et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- The current understanding on the diamond machining of silicon carbide
- (2014) Saurav Goel JOURNAL OF PHYSICS D-APPLIED PHYSICS
- Damage-free machining of monocrystalline silicon carbide
- (2013) Hiroaki Tanaka et al. CIRP ANNALS-MANUFACTURING TECHNOLOGY
- Brittle–ductile transition during diamond turning of single crystal silicon carbide
- (2012) Saurav Goel et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Onset Plastic Deformation and Cracking Behavior of Silicon Carbide under Contact Load at Room Temperature
- (2011) Xiaofeng Zhao et al. JOURNAL OF THE AMERICAN CERAMIC SOCIETY
- Hybrid polishing mechanism of single crystal SiC using mixed abrasive slurry (MAS)
- (2010) H.S. Lee et al. CIRP ANNALS-MANUFACTURING TECHNOLOGY
- Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding
- (2007) Sanjay Agarwal et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
Create your own webinar
Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.
Create NowBecome a Peeref-certified reviewer
The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.
Get Started