Debris-free rear-side picosecond laser ablation of thin germanium wafers in water with ethanol

Title
Debris-free rear-side picosecond laser ablation of thin germanium wafers in water with ethanol
Authors
Keywords
Laser cutting, Liquid cutting, Germanium cutting
Journal
APPLIED SURFACE SCIENCE
Volume 367, Issue -, Pages 222-230
Publisher
Elsevier BV
Online
2016-01-13
DOI
10.1016/j.apsusc.2016.01.071

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