Two-step flash light sintering of copper nanoparticle ink to remove substrate warping

Published 2016 View Full Article

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Title
Two-step flash light sintering of copper nanoparticle ink to remove substrate warping
Authors
Keywords
Printed electronics, Two-step flash light sintering, Substrate warping, In situ monitoring, copper nanoparticles
Journal
APPLIED SURFACE SCIENCE
Volume 384, Issue -, Pages 182-191
Publisher
Elsevier BV
Online
2016-05-08
DOI
10.1016/j.apsusc.2016.05.025

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