Journal
JOURNAL OF COLLOID AND INTERFACE SCIENCE
Volume 548, Issue -, Pages 255-264Publisher
ACADEMIC PRESS INC ELSEVIER SCIENCE
DOI: 10.1016/j.jcis.2019.04.044
Keywords
Visible light; BiOI-Bi2O3; Plasmonic Bi; SPR; Phenol degradation
Categories
Funding
- National Natural Science Foundation of China [21876154]
- Zhejiang Provincial Natural Science Foundation of China [LR18B070001, Y18B060003, Y201432049]
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Plasmonic Bi-0 modified BiOI-Bi2O3 composite (Bi/BiOI-Bi2O3) was prepared via in situ UV reduction method. X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM) techniques were carried out to identify the formation of semimetal Bi-0. The results indicated that the dot-like bismuth particles were originated from the partial reduction of lattice Bi3+. to Bi-0 by accumulated conduction band electrons in BiOI-Bi2O3. The as-prepared ternary composite exhibited enhanced visible-light-response, decreased charge transfer impedance and higher charge carrier density relative to unmodified BiOI-Bi2O3. Due to synergistic effect between plasmonic Bi-0 and BiOI-Bi2O3 heterojunction, dramatically enhanced photocatalytic activity for phenol degradation can be achieved. After 3.5 h visible light irradiation, the value for phenol removal efficiency was ca. 60% and 100% on BiOI-Bi2O3 and Bi/BiOI-Bi2O3, respectively. The calculated zero-order rate constant on Bi/BiOI-Bi2O3 was 1.7 and 3.9 times that on BiOI-Bi2O3 and Bi2O3, respectively. In addition to phenol, organic dyes (zwitterionic RhB, cationic MB and anionic Org II) were also used as model pollutants. Pronounced photocatalytic degradation by Bi/BiOI-Bi2O3 can be observed, further confirming the importance of Bi-0. Trapping experiments using different scavengers indicated that photogenerated holes were major active species during the degradation of phenol. Furthermore, good stability was also observed in 5 successive cyclic runs. This study opens a new strategy for in situ preparation of plasmonic Bi-0 modified composite. (C) 2019 Elsevier Inc. All rights reserved.
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