A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications
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Title
A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications
Authors
Keywords
Through silicon via, CMOS technology, Neural probe array, Electrode, Heterogeneous integration
Journal
BIOMEDICAL MICRODEVICES
Volume 17, Issue 1, Pages -
Publisher
Springer Nature
Online
2015-02-04
DOI
10.1007/s10544-014-9906-9
References
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