Second-harmonic microscopy of strain fields around through-silicon-vias

Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

(2015) Parisa Bayat et al.   MICROELECTRONIC ENGINEERING

Surface second harmonic generation induced by 3D strain fields

(2015) Bernardo S. Mendoza et al.   PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS

Multiwavelength Raman characterization of silicon stress near through-silicon vias and its inline monitoring applications

(2014) Woo Sik Yoo et al.   Journal of Micro-Nanolithography MEMS and MOEMS

Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects

(2012) Suk-Kyu Ryu et al.   JOURNAL OF APPLIED PHYSICS

Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias

(2012) Tengfei Jiang et al.   MICROELECTRONICS RELIABILITY

Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV)

(2011) P. Kumar et al.   JOURNAL OF ELECTRONIC MATERIALS

Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

(2011) A.S. Budiman et al.   MICROELECTRONICS RELIABILITY

Second-harmonic generation in silicon waveguides strained by silicon nitride

(2011) M. Cazzanelli et al.   NATURE MATERIALS