Copper Interconnects: Surface State Engineering to Facilitate Specular Electron Scattering

Published 2019 View Full Article

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Title
Copper Interconnects: Surface State Engineering to Facilitate Specular Electron Scattering
Authors
Keywords
-
Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 66, Issue 6, Pages 2692-2698
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2019-04-27
DOI
10.1109/ted.2019.2910500

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