Electrical Conductivity Enhancement of Epoxy by Hybrid Carbon Nanotubes and Self-made Silver Nanoparticles

Synergistic effect of CNT films impregnated with CNT modified epoxy solution towards boosted interfacial bonding and functional properties of the composites

(2018) Ifra Marriam et al.   COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING

The mechanical strength, degree of hydration, and electrical resistivity of cement pastes modified with superabsorbent polymers

(2016) K. Farzanian et al.   CONSTRUCTION AND BUILDING MATERIALS

Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection

(2016) Guoyun Zhou et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Ternary Ag/Epoxy Adhesive with Excellent Overall Performance

(2015) Yan-Hong Ji et al.   ACS Applied Materials & Interfaces

Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications

(2015) Behnam Meschi Amoli et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

High-concentration copper nanoparticles synthesis process for screen-printing conductive paste on flexible substrate

(2015) Sze Kee Tam et al.   JOURNAL OF NANOPARTICLE RESEARCH

Silver-coated glass fibers prepared by a simple electroless plating technique

(2014) Chunju Xu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

One step synthesis of silver nanowires used in preparation of conductive silver paste

(2014) Yao Tang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging

(2013) Hui-Wang Cui et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Electrical property improvement of dicyandiamide-cured electrically conductive adhesives through in-situ replacement by difunctional acids and the impact on storage

(2013) Ling Wang et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Additive Effect of Poly(4-vinylphenol) Gate Dielectric in Organic Thin Film Transistor at Low Temperature Process

(2013) Ho-Jin Yun et al.   JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY

Deep crystallization induced high thermal conductivity of low-temperature sintered Ag nanoparticles

(2013) Hongjun Ji et al.   MATERIALS LETTERS

Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging

(2013) Shuai Wang et al.   SCRIPTA MATERIALIA

Effects of crystallization and dopant concentration on the emission behavior of TiO2:Eu nanophosphors

(2012) Mou Pal et al.   Nanoscale Research Letters

Increasing the bonding strength of chips on flex substrates using thermosonic flip-chip bonding process with nonconductive paste

(2009) Cheng-Li Chuang et al.   MICROELECTRONIC ENGINEERING