Heat transfer within mortar containing micro-encapsulated PCM: Numerical approach

Title
Heat transfer within mortar containing micro-encapsulated PCM: Numerical approach
Authors
Keywords
Microencapsulated PCM, Heat transfer, Building, DSC, Hysteresis phenomenon
Journal
CONSTRUCTION AND BUILDING MATERIALS
Volume 210, Issue -, Pages 422-433
Publisher
Elsevier BV
Online
2019-03-21
DOI
10.1016/j.conbuildmat.2019.03.177

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