Journal
APPLIED SURFACE SCIENCE
Volume 479, Issue -, Pages 368-374Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.apsusc.2019.01.262
Keywords
Adsorption behaviors; Metallic ions; Thiol-containing silane; Flexible electronic
Categories
Funding
- Open Funds of National Engineering Research Center of Near-Net-Shape Forming for Metallic Materials [2018008]
- Innovative Design/Manufacturing Technologies of SIP
- Ministry of Economy, Trade and Industry of Japan
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Here we demonstrate the adsorption behaviors of typical deposition-targeted metallic (Ag, Cu or Ni) ions on thiol-end surfaces during electroless deposition using for fabricating flexible electronics. Specific thiol-containing silane molecules were assembled onto the corona activated liquid crystal polymer surfaces and then metallic ions were adsorbed onto the modified surfaces. By using X-ray photoelectron spectroscopy, scanning electron microscope and atomic force microscope, the assembly processes, inter-reaction mechanism of these ions with thiol-end groups, and adsorption behaviors have been investigated in details. Thickness of the molecule layer was estimated as some nanometers. Besides, zeta-potential and wettability were used to characterize the surfaces and verify the adsorption behaviors. Overall, this work provides a helpful contribution for understanding circuits' deposition processes and fabricating flexible patterns for electronic devices.
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