Tin Whisker Growth Inhibition in RE-Doped Sn-Zn Soldered Joints

The role of delayed elasticity and stress relaxation in Sn-Bi-Cu lead-free solders solidified under permanent magnet stirring

(2018) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Design and Properties of New Lead-Free Solder Joints Using Sn-3.5Ag-Cu Solder

(2018) Rizk Mostafa Shalaby et al.   Silicon

Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

(2017) Amir Hossein Nobari et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of intermetallic compounds on mechanical properties of copper joints ultrasonic-soldered with Sn-Zn alloy

(2017) Tianmin Luan et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Effects of intermetallic-forming element additions on microstructure and corrosion behavior of Sn–Zn solder alloys

(2016) Jian-Chun Liu et al.   CORROSION SCIENCE

Effect of Zn concentration on the interfacial reactions between Sn–3.0Ag–0.5Cu solder and electroplated Cu–xZn wetting layers (x = 0–43 wt%)

(2016) Jae-Yong Park et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Thermal property, wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders

(2015) Jian-Chun Liu et al.   MATERIALS & DESIGN

Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga

(2014) Peng Xue et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of Pr on properties and Sn whisker growth of Sn‐9Zn‐xPr solder

(2013) Peng Xue et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.06Nd/Cu joints with aging treatment

(2011) Yu-hua Hu et al.   MATERIALS & DESIGN

Sn whisker growth in Sn–9Zn–0.5Ga–0.7Pr lead-free solder

(2010) Huan Ye et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of rare earth element Nd on the solderability and microstructure of Sn–Zn lead-free solder

(2010) Yu-hua Hu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder

(2009) Lili Gao et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of rare earth Ce on microstructures, solderability of Sn–Ag–Cu and Sn–Cu–Ni solders as well as mechanical properties of soldered joints

(2007) Jian-Xin Wang et al.   JOURNAL OF ALLOYS AND COMPOUNDS