Study of dynamic recrystallization behavior of T2 copper in hot working conditions by experiments and cellular automaton method

Published 2019 View Full Article

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Title
Study of dynamic recrystallization behavior of T2 copper in hot working conditions by experiments and cellular automaton method
Authors
Keywords
T2 copper, Hot compression, Dynamic recrystallization, Cellular automaton, Grain size
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 784, Issue -, Pages 1071-1083
Publisher
Elsevier BV
Online
2019-01-15
DOI
10.1016/j.jallcom.2019.01.132

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