Structure and stress of Cu films prepared by high power pulsed magnetron sputtering

Published 2018 View Full Article

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Title
Structure and stress of Cu films prepared by high power pulsed magnetron sputtering
Authors
Keywords
Cu films, Stress, (111) texture, Adhesion, Ti interlayer, High power pulsed magnetron sputtering (HPPMS)
Journal
VACUUM
Volume 160, Issue -, Pages 226-232
Publisher
Elsevier BV
Online
2018-11-21
DOI
10.1016/j.vacuum.2018.11.039

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