Evolution of the interfacial microstructure during the plastic deformation bonding of copper

Published 2018 View Full Article

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Title
Evolution of the interfacial microstructure during the plastic deformation bonding of copper
Authors
Keywords
Copper bonding, Hot compression bonding, Dynamic recrystallization, Grain boundary, Dislocation wall
Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 746, Issue -, Pages 1-10
Publisher
Elsevier BV
Online
2018-12-29
DOI
10.1016/j.msea.2018.12.119

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