Interfacial Reactions in the Cu/Ga/Co and Cu/Ga/Ni Samples

The bridge between the materials and devices of thermoelectric power generators

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A comprehensive review of thermoelectric technology: Materials, applications, modelling and performance improvement

(2016) Ssennoga Twaha et al.   RENEWABLE & SUSTAINABLE ENERGY REVIEWS

Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation

(2015) Antti Rautiainen et al.   JOURNAL OF ELECTRONIC MATERIALS

Improvement of bonding strength of a (Pb,Sn)Te–Cu contact manufactured in a low temperature SLID-bonding process

(2014) Tung-Han Chuang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Kinetics of Dissolution and Isothermal Solidification for Gold-Enriched Solid–Liquid Interdiffusion (SLID) Bonding

(2013) Rogie I. Rodriguez et al.   JOURNAL OF ELECTRONIC MATERIALS

Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples

(2013) Shih-kang Lin et al.   JOURNAL OF ELECTRONIC MATERIALS

A review on thermoelectric renewable energy: Principle parameters that affect their performance

(2013) Mohamed Hamid Elsheikh et al.   RENEWABLE & SUSTAINABLE ENERGY REVIEWS

Perspectives on thermoelectrics: from fundamentals to device applications

(2011) M. Zebarjadi et al.   Energy & Environmental Science

Au-Sn SLID Bonding—Properties and Possibilities

(2011) Torleif A. Tollefsen et al.   METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE

Thermodynamic remodeling of the Co–Ga system

(2010) Arpita Chari et al.   CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY

A thermodynamic assessment of the copper–gallium system

(2008) J.-B. Li et al.   CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY

Complex thermoelectric materials

(2008) G. Jeffrey Snyder et al.   NATURE MATERIALS