Heat transfer improvement in microchannel heat sink by topology design and optimization for high heat flux chip cooling

Title
Heat transfer improvement in microchannel heat sink by topology design and optimization for high heat flux chip cooling
Authors
Keywords
Topology structure, Spider netted microchannel, Parameter optimization, High heat flux chip cooling
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 129, Issue -, Pages 681-689
Publisher
Elsevier BV
Online
2018-10-11
DOI
10.1016/j.ijheatmasstransfer.2018.09.092

Ask authors/readers for more resources

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started