Copper–Nickel Alloy Plating to Improve the Contact Resistivity of Metal Grid on Silicon Heterojunction Solar Cells

Title
Copper–Nickel Alloy Plating to Improve the Contact Resistivity of Metal Grid on Silicon Heterojunction Solar Cells
Authors
Keywords
Silicon heterojunction solar cells, Cu–Ni alloy plating, Seed layer, Contact resistivity, Copper plating
Journal
Electronic Materials Letters
Volume -, Issue -, Pages -
Publisher
Springer Nature
Online
2019-03-29
DOI
10.1007/s13391-019-00134-x

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